Welding & Soldering Equipment

1 xsolid Rosin Paste.

The quality of solder paste, excellent wetting, high reliability. 1PCS Solder paste. Alloy : Sn63/Pb37. Microns : 25-45um.

If the solder paste is ingested. 1 x MCN-300 Soldering Welding Paste. Alloy : Sn63/Pb37. (at 0 to 10°). Type : XG-50. Weight : about 35 grams. To the USA. When using, do not drink eat or smoke.

1 x Bottle 30ml. Ideal flux dispenser. 11 x Needles. Material:Transparent Polyethylene.

It is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue, so you are easy to clean the board. Joint High Intensity. We will leave it for everyone that leaves it for us.

Capacity: 10ml. 10ml pen applicator with specially designed felt tip. Halogen-free, non-rosin organic flux pen. Exhibits improved soldering performance to minimize solder bridges (shorts) during rework operations.

Brand Unbranded/Generic Model 63/37 MPN Does Not Apply Country/Region of Manufacture China UPC Does not apply.

Products Features: 100% Brand new and high quality. Electrode clip for the copper material, a very small amount of impurities, especially phosphorus, arsenic, aluminum, etc., will greatly reduce the copper conductivity.   Products Specifications: Name: TIG welding gun accessories.

Length: 5 foot (1.5m) Width: 2.0 mm. Package Includes:1 X 5 Ft. 2.0 Mm Desoldering Braid Solder. Type: brand new CP-2015.

100g AMTECH NC-559-ASM BGA PCB SMT IC Reballing Soldering Paste Flux Grease. 1 x 100g AMTECH NC-559-ASM BGA PCB SMT IC Reballing Soldering Paste Flux Grease. North and south bridge, cards, cell phone chip, video chip BGA solder, bumping.

High output goot PX-20H ceramic heater (70 Watts). Soldering iron tip Goot PX-2RT-SB. Soldering iron tip Goot PX-2RT-1.6D. Soldering iron tip Goot PX-2RT-2.4D. Soldering iron tip Goot PX-2RT-2C. Soldering iron tip Goot PX-2RT-2CR.

This 3 pieces bga stencils tin plate was for samsung HUAWEI Android MTK series chip IC reballing repair. 1x BGA Reballing Stencils for A418 samsung HTC HUAWEI android MTK. 1x BGA Reballing Stencils for A90 MTK series.

Quantity: 1 set （27pcs）. 27pcs stencils are as follows These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Large set of common need in BGA working. 1pc 1 universal stencil (P=1.5mm) 48mm×48mm.

1 x PCB Holder tool. When you install your circuit board to the holder, it is better to install one side then the other. Color: As picture shows. The bayonet can be move, you can choose the best position to hold your circuit board.

Suitable for electric welding, gas shielded welding, argon arc welding, two welding, polishing, polishing, etc. This mask is worn when welding, and will automatically sensitize light after the single, so that the welding process is not glare and does not hurt the eyes.

No false welding, strong adhesive with solder iron tip. White and plump solder joint. checkout, it can't be changed once order completed. for it free. To Other Country. best give a satisfied solution.

1 X Solder Tin Wire. Increase the speed of cleaning the PCB pad. Speed up the speed of absorbing tin and low residue of flux. Tool may have dust or appearance minor defect,it does not affect function.

1 x Soldering Iron Handle. 1 x Soldering Iron Holder. The Station Output power can reach 75W, higher than most station on the market. Temperature adjusted by simply turning the dial. Slender iron handles are insulated and ergonomic-designed for ease and comfort.

Quantity: 130pcs. These stencils were made by high quality material, can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. They can be heated by the hot air machine, these stencils are not easy to deform when heated.