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Solder Paste in Electronics Packaging Technology and Applications in Surfac 2346
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2 available
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International shipment of items may be subject to customs processing and additional charges.
Located in: Idstein, Germany
Delivery:
Estimated between Mon, Jun 17 and Fri, Jun 28 to 43230
Please allow additional time if international delivery is subject to customs processing.
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Seller information
- 98.6% positive feedback
Registered as a Business Seller
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eBay item number:256495858502
Item specifics
- Condition
- EAN
- 9789401160520
- ISBN
- 940116052X
- Autor
- Hwang, Jennie S.
- Buchtitel
- Solder Paste in Electronics Packaging Technology and Applications
- Sprache
- Englisch
- Format
- 456 pages; XXIV, 456 p.; 26 x 152 x 229 mm
- Verlag
- 2012
- Produktart
- Paperback / Softback
- Anzahl der Seiten
- 456 pages
- Gewicht
- 694g
Item description from the seller
Business seller information
Value Added Tax Number:
- DE 262837513
Seller assumes all responsibility for this listing.
eBay item number:256495858502
Shipping and handling
EUR4.00 shipping for each additional eligible item you buy from getbooks-de. |
Item location:
Idstein, Germany
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PO Box, Asia, Middle East, Oceania, Russian Federation, South America, Southeast Asia
Shipping and handling | Each additional item | To | Service | Delivery*See Delivery notes |
---|---|---|---|---|
EUR 15.00 (approx C $22.28) | EUR 8.00 (approx C $11.88) | United States | Standard Shipping (Standard International) | Estimated between Mon, Jun 17 and Fri, Jun 28 to 43230 |
Handling time |
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Will usually ship within 3 business days of receiving cleared payment. |
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Sales tax for an item #256495858502
Sales tax for an item #256495858502
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Return policy
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Accepted within 1 month |
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