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Item specifics

Condition
Brand New: A new, unread, unused book in perfect condition with no missing or damaged pages. See the ...
Book Title
Preventing Thermal Cycling and Vibration Failures in Electronic E
Publication Date
2001-07-11
Pages
304
ISBN
9780471357292
Publication Year
2001
Type
Textbook
Format
Hardcover
Language
English
Publication Name
Preventing Thermal Cycling and Vibration Failures in Electronic Equipment
Item Height
1.2in
Author
Dave S. Steinberg
Item Length
9.3in
Publisher
Wiley & Sons, Incorporated, John
Item Width
6.5in
Item Weight
21.6 Oz
Number of Pages
304 Pages

About this product

Product Information

This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.

Product Identifiers

Publisher
Wiley & Sons, Incorporated, John
ISBN-10
0471357294
ISBN-13
9780471357292
eBay Product ID (ePID)
1928837

Product Key Features

Author
Dave S. Steinberg
Publication Name
Preventing Thermal Cycling and Vibration Failures in Electronic Equipment
Format
Hardcover
Language
English
Publication Year
2001
Type
Textbook
Number of Pages
304 Pages

Dimensions

Item Length
9.3in
Item Height
1.2in
Item Width
6.5in
Item Weight
21.6 Oz

Additional Product Features

Lc Classification Number
Tk7870.25.S7324 2001
Reviews
"...text s purpose is to show manufacturers how to design, analyze, and evaluate electronic systems for lower cost and improved reliability in harsh environments..." (SciTech Book News, Vol. 25, No. 4, December 2001), "...text's purpose is to show manufacturers how to design, analyze, and evaluate electronic systems for lower cost and improved reliability in harsh environments..." (SciTech Book News, Vol. 25, No. 4, December 2001)
Table of Content
Preface. Symbols. Physics of Failure In Electronic Systems. Thermal Expansion Displacements, Forces, and Stresses. Vibration of Beams and Other Simple Structures. Vibration of Printed Circuit Boards and Flat Plates. Estimating Fatigue Life in Thermal Cycling and VibrationEnvironments. Octave Rule, Snubbers, Dampers, and Isolation for PreventingVibration Damage to Electronic Systems. Displacements, Forces, and Stresses in Axial Leaded ComponentWires Due to Thermal Expansions. Designing Electronic Equipment for Sinusoidal Vibration. Assessment of Random Vibration on Electronic Design. Combining Fatigue Damage for Random Vibration and Thermal Cycling. Thermal Cycling Failures in Surface-Mounted Components. Stresses and Fatigue Life in Component Lead Wires and SolderJoints Due to Dynamic Forces and PCB Displacements. Fatigue Life of Long Components, Tall Components, and SmallComponents Mounted on PCBs. Wear and Interface Surface Fretting Corrosion in ElectricalConnectors. Case Histories of Failures and Failure Analyses. Bibliography. Index.
Copyright Date
2001
Topic
Waves & Wave Mechanics, Electrical, Electronics / General
Lccn
2001-024704
Dewey Decimal
621.381/04
Intended Audience
Scholarly & Professional
Dewey Edition
21
Illustrated
Yes
Genre
Technology & Engineering, Science

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AlibrisBooks

AlibrisBooks

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Most relevant reviews

  • Theory and modeling of failure mechanisms in electronic systems subject to vibration and thermal cycling

    Would be better if it gave concrete examples for common components.

    Verified purchase: YesCondition: Pre-OwnedSold by: ayeres_books