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Jennie Hwang Implementing Lead-Free Electronics (Hardback) (UK IMPORT)
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Item specifics
- Condition
- Book Title
- Implementing Lead-Free Electronics
- Publication Name
- Implementing Lead-Free Electronics
- Title
- Implementing Lead-Free Electronics
- Format
- Hardcover
- EAN
- 9780071443746
- ISBN
- 9780071443746
- Publisher
- Mcgraw-Hill Education
- Genre
- Technology & Engineering
- Release Date
- 16/01/2005
- Release Year
- 2005
- Language
- English
- Country/Region of Manufacture
- US
- Item Height
- 1.6 in
- Item Length
- 9.1 in
- Item Width
- 6.2 in
- Item Weight
- 29.9 Oz
- Series
- Professional Engineering
- Publication Year
- 2004
- Illustrator
- Yes
- Topic
- Telecommunications, Electronics / General
- Number of Pages
- 473 Pages
About this product
Product Identifiers
Publisher
Mcgraw-Hill Education
ISBN-10
0071443746
ISBN-13
9780071443746
eBay Product ID (ePID)
30773800
Product Key Features
Book Title
Implementing Lead-Free Electronics
Number of Pages
473 Pages
Language
English
Publication Year
2004
Topic
Telecommunications, Electronics / General
Illustrator
Yes
Genre
Technology & Engineering
Format
Hardcover
Dimensions
Item Height
1.6 in
Item Weight
29.9 Oz
Item Length
9.1 in
Item Width
6.2 in
Additional Product Features
Intended Audience
Trade
LCCN
2004-059234
Reviews
REVIEWED BY: Dr. George Riley, FlipChips Dot Com Dr. Jennie Hwang's second major book on lead-free electronics plays the ministerial role to its magisterial predecessor. It is the facilitator, carrying us from the calm of the laboratory to the clamor of the factory floor, where theories and realities collide. In the lead-free as in other worlds, implementation, not theory, ultimately determines survival. The book patterns itself on the flow of factory implementation, moving from selecting the best approach, to choosing proper materials, to controlling the soldering operation, to concerns about compatibility, costs, and reliability. The prelude is a reality check of present manufacturing practices. Here Dr. Hwang shows us how the actual conditions of use for today's eutectic lead-tin solders, rather than theoretical arguments, justify the "drop-in" approach to lead-free replacements. Present peak soldering temperatures of 230° C to 245° C are robust process parameters for printed-circuit board assembly with present surface-mount technology. Several lead-free solder formulations applicable in that temperature range promise a smooth transition to lead-free soldering, at lower costs. Manufacturing implementation follows upon a five-step evaluation. The key is recognizing the interdependence of process decisions, to insure compatibility at every stage. Solder selection summarizes some of the voluminous technical detail of Dr. Hwang's prior book, supplemented with side-by-side solder comparisons. It segues smoothly into stencil selection and solder paste application. Dr. Hwang applies an interdisciplinary headlock to embrace the physics, chemistry, metallurgy, and rheology of solder. Who would have thought that tiny little spheres could cause us so many problems? Once we are well pasted and on our way with compatible components, we are ready for the oven. Mass reflow soldering and wave soldering comprise separate chapters, again starting from a solid base of "real-world production demands." For mass reflow soldering, these include the difficulty of monitoring and controlling temperatures in a fast-moving environment. A six-pack of case studies with photographs illustrates the best practice in defect reduction. The specialty approaches of nitrogen atmosphere reflow, convection reflow, and vapor phase soldering are treated briefly, but with lead-free respect. Wave soldering is dismembered in detail. New hobgoblins here are dross, corrosion, turbulence, and compositional stability. Again, case studies tie the text to factory-based data. The specialized approaches of selective soldering and laser soldering are examined and found not wanting in lead-free suitability. Compatibility checklists remind us that no solder pot is an island. Cost simulations are presented as case studies, based upon manufacturer's models. The reliability discourse highlights the causes and cures of commonly occurring production ills. The open, bullet-point format of much of the material will make this a handy reference book, as well as a worthy supplement to its predecessor. Dr. Hwang has enlisted her long industry experience, her understanding of solder manufacturing, and her sensitivity to the concerns of students in her lead-free training courses to present an exhaustive, normative, two-volume approach to lead-free technology and implementation., REVIEWED BY: Dr. George Riley, FlipChips Dot Com Dr. Jennie Hwang's second major book on lead-free electronics plays the ministerial role to its magisterial predecessor. It is the facilitator, carrying us from the calm of the laboratory to the clamor of the factory floor, where theories and realities collide. In the lead-free as in other worlds, implementation, not theory, ultimately determines survival. The book patterns itself on the flow of factory implementation, moving from selecting the best approach, to choosing proper materials, to controlling the soldering operation, to concerns about compatibility, costs, and reliability. The prelude is a reality check of present manufacturing practices. Here Dr. Hwang shows us how the actual conditions of use for today's eutectic lead-tin solders, rather than theoretical arguments, justify the "drop-in" approach to lead-free replacements. Present peak soldering temperatures of 230deg; C to 245deg; C are robust process parameters for printed-circuit board assembly with present surface-mount technology. Several lead-free solder formulations applicable in that temperature range promise a smooth transition to lead-free soldering, at lower costs. Manufacturing implementation follows upon a five-step evaluation. The key is recognizing the interdependence of process decisions, to insure compatibility at every stage. Solder selection summarizes some of the voluminous technical detail of Dr. Hwang's prior book, supplemented with side-by-side solder comparisons. It segues smoothly into stencil selection and solder paste application. Dr. Hwang applies an interdisciplinary headlock to embrace the physics, chemistry, metallurgy, and rheology of solder. Who would have thought that tiny little spheres could cause us so many problems? Once we are well pasted and on our way with compatible components, we are ready for the oven. Mass reflow soldering and wave soldering comprise separate chapters, again starting from a solid base of "real-world production demands." For mass reflow soldering, these include the difficulty of monitoring and controlling temperatures in a fast-moving environment. A six-pack of case studies with photographs illustrates the best practice in defect reduction. The specialty approaches of nitrogen atmosphere reflow, convection reflow, and vapor phase soldering are treated briefly, but with lead-free respect. Wave soldering is dismembered in detail. New hobgoblins here are dross, corrosion, turbulence, and compositional stability. Again, case studies tie the text to factory-based data. The specialized approaches of selective soldering and laser soldering are examined and found not wanting in lead-free suitability. Compatibility checklists remind us that no solder pot is an island. Cost simulations are presented as case studies, based upon manufacturer's models. The reliability discourse highlights the causes and cures of commonly occurring production ills. The open, bullet-point format of much of the material will make this a handy reference book, as well as a worthy supplement to its predecessor. Dr. Hwang has enlisted her long industry experience, her understanding of solder manufacturing, and her sensitivity to the concerns of students in her lead-free training courses to present an exhaustive, normative, two-volume approach to lead-free technology and implementation., REVIEWED BY: Dr. George Riley, FlipChips Dot Com Dr. Jennie Hwang's second major book on lead-free electronics plays the ministerial role to its magisterial predecessor. It is the facilitator, carrying us from the calm of the laboratory to the clamor of the factory floor, where theories and realities collide. In the lead-free as in other worlds, implementation, not theory, ultimately determines survival. The book patterns itself on the flow of factory implementation, moving from selecting the best approach, to choosing proper materials, to controlling the soldering operation, to concerns about compatibility, costs, and reliability. The prelude is a reality check of present manufacturing practices. Here Dr. Hwang shows us how the actual conditions of use for today's eutectic lead-tin solders, rather than theoretical arguments, justify the "drop-in" approach to lead-free replacements. Present peak soldering temperatures of 230 C to 245 C are robust process parameters for printed-circuit board assembly with present surface-mount technology. Several lead-free solder formulations applicable in that temperature range promise a smooth transition to lead-free soldering, at lower costs. Manufacturing implementation follows upon a five-step evaluation. The key is recognizing the interdependence of process decisions, to insure compatibility at every stage. Solder selection summarizes some of the voluminous technical detail of Dr. Hwange(tm)s prior book, supplemented with side-by-side solder comparisons. It segues smoothly into stencil selection and solder paste application. Dr. Hwang applies an interdisciplinary headlock to embrace the physics, chemistry, metallurgy, and rheology of solder. Who would have thought that tiny little spheres could cause us so many problems? Once we are well pasted and on our way with compatible components, we are ready for the oven. Mass reflow soldering and wave soldering comprise separate chapters, again starting from a solid base of "real-world production demands." For mass reflow soldering, these include the difficulty of monitoring and controlling temperatures in a fast-moving environment. A six-pack of case studies with photographs illustrates the best practice in defect reduction. The specialty approaches of nitrogen atmosphere reflow, convection reflow, and vapor phase soldering are treated briefly, but with lead-free respect. Wave soldering is dismembered in detail. New hobgoblins here are dross, corrosion, turbulence, and compositional stability. Again, case studies tie the text to factory-based data. The specialized approaches of selective soldering and laser soldering are examined and found not wanting in lead-free suitability. Compatibility checklists remind us that no solder pot is an island. Cost simulations are presented as case studies, based upon manufacturere(tm)s models. The reliability discourse highlights the causes and cures of commonly occurring production ills. The open, bullet-point format of much of the material will make this a handy reference book, as well as a worthy supplement to its predecessor. Dr. Hwang has enlisted her long industry experience, her understanding of solder manufacturing, and her sensitivity to the concerns of students in her lead-free training courses to present an exhaustive, normative, two-volume approach to lead-free technology and implementation., REVIEWED BY: Dr. George Riley, FlipChips Dot ComDr. Jennie Hwang's second major book on lead-free electronics plays the ministerial role to its magisterial predecessor. It is the facilitator, carrying us from the calm of the laboratory to the clamor of the factory floor, where theories and realities collide. In the lead-free as in other worlds, implementation, not theory, ultimately determines survival.The book patterns itself on the flow of factory implementation, moving from selecting the best approach, to choosing proper materials, to controlling the soldering operation, to concerns about compatibility, costs, and reliability. The prelude is a reality check of present manufacturing practices.Here Dr. Hwang shows us how the actual conditions of use for today's eutectic lead-tin solders, rather than theoretical arguments, justify the "drop-in" approach to lead-free replacements. Present peak soldering temperatures of 230° C to 245° C are robust process parameters for printed-circuit board assembly with present surface-mount technology. Several lead-free solder formulations applicable in that temperature range promise a smooth transition to lead-free soldering, at lower costs.Manufacturing implementation follows upon a five-step evaluation. The key is recognizing the interdependence of process decisions, to insure compatibility at every stage. Solder selection summarizes some of the voluminous technical detail of Dr. Hwang's prior book, supplemented with side-by-side solder comparisons. It segues smoothly into stencil selection and solder paste application. Dr. Hwang applies an interdisciplinary headlock to embrace the physics, chemistry, metallurgy, and rheology of solder. Who would have thought that tiny little spheres could cause us so many problems?Once we are well pasted and on our way with compatible components, we are ready for the oven. Mass reflow soldering and wave soldering comprise separate chapters, again starting from a solid base of "real-world production demands." For mass reflow soldering, these include the difficulty of monitoring and controlling temperatures in a fast-moving environment. A six-pack of case studies with photographs illustrates the best practice in defect reduction. The specialty approaches of nitrogen atmosphere reflow, convection reflow, and vapor phase soldering are treated briefly, but with lead-free respect.Wave soldering is dismembered in detail. New hobgoblins here are dross, corrosion, turbulence, and compositional stability. Again, case studies tie the text to factory-based data. The specialized approaches of selective soldering and laser soldering are examined and found not wanting in lead-free suitability.Compatibility checklists remind us that no solder pot is an island. Cost simulations are presented as case studies, based upon manufacturer's models. The reliability discourse highlights the causes and cures of commonly occurring production ills.The open, bullet-point format of much of the material will make this a handy reference book, as well as a worthy supplement to its predecessor. Dr. Hwang has enlisted her long industry experience, her understanding of solder manufacturing, and her sensitivity to the concerns of students in her lead-free training courses to present an exhaustive, normative, two-volume approach to lead-free technology and implementation., REVIEWED BY: Dr. George Riley, FlipChips Dot ComDr. Jennie Hwang's second major book on lead-free electronics plays the ministerial role to its magisterial predecessor. It is the facilitator, carrying us from the calm of the laboratory to the clamor of the factory floor, where theories and realities collide. In the lead-free as in other worlds, implementation, not theory, ultimately determines survival.The book patterns itself on the flow of factory implementation, moving from selecting the best approach, to choosing proper materials, to controlling the soldering operation, to concerns about compatibility, costs, and reliability. The prelude is a reality check of present manufacturing practices.Here Dr. Hwang shows us how the actual conditions of use for today's eutectic lead-tin solders, rather than theoretical arguments, justify the "drop-in" approach to lead-free replacements. Present peak soldering temperatures of 230deg; C to 245deg; C are robust process parameters for printed-circuit board assembly with present surface-mount technology. Several lead-free solder formulations applicable in that temperature range promise a smooth transition to lead-free soldering, at lower costs.Manufacturing implementation follows upon a five-step evaluation. The key is recognizing the interdependence of process decisions, to insure compatibility at every stage. Solder selection summarizes some of the voluminous technical detail of Dr. Hwang's prior book, supplemented with side-by-side solder comparisons. It segues smoothly into stencil selection and solder paste application. Dr. Hwang applies an interdisciplinary headlock to embrace the physics, chemistry, metallurgy, and rheology of solder. Who would have thought that tiny little spheres could cause us so many problems?Once we are well pasted and on our way with compatible components, we are ready for the oven. Mass reflow soldering and wave soldering comprise separate chapters, again starting from a solid base of "real-world production demands." For mass reflow soldering, these include the difficulty of monitoring and controlling temperatures in a fast-moving environment. A six-pack of case studies with photographs illustrates the best practice in defect reduction. The specialty approaches of nitrogen atmosphere reflow, convection reflow, and vapor phase soldering are treated briefly, but with lead-free respect.Wave soldering is dismembered in detail. New hobgoblins here are dross, corrosion, turbulence, and compositional stability. Again, case studies tie the text to factory-based data. The specialized approaches of selective soldering and laser soldering are examined and found not wanting in lead-free suitability.Compatibility checklists remind us that no solder pot is an island. Cost simulations are presented as case studies, based upon manufacturer's models. The reliability discourse highlights the causes and cures of commonly occurring production ills.The open, bullet-point format of much of the material will make this a handy reference book, as well as a worthy supplement to its predecessor. Dr. Hwang has enlisted her long industry experience, her understanding of solder manufacturing, and her sensitivity to the concerns of students in her lead-free training courses to present an exhaustive, normative, two-volume approach to lead-free technology and implementation.
Dewey Edition
22
Dewey Decimal
621.381/028/6
Table Of Content
Chapter 1: Introduction Chapter 2: Manufacturing Implementation Approaches Chapter 3: Selecting Lead-Free Alloys for Solder Interconnections Chapter 4: Applying Solder Paste Chapter 5: Selecting Component Coating and PCB Surface Finish Chapter 6: Applying Mass Reflow Soldering Chapter 7: Wave Soldering and Selective Soldering Chapter 8: Compatibility and Cost Considerations Chapter 9: Other Manufacturing and Common Production Defect Considerations Chapter 10: Reliability and Accelerated Temperature Cycling Tests
Synopsis
By 2006, any company selling electronics to European Union nations and China will have to convert to a lead-free manufacturing process. This resource shows manufacturers how to select the right Lead Free process and make the conversion as efficient and inexpensive as possible. Contents: Selecting Component LeadCoating * Selecting PCB Surface Finish * Manufacturing Approaches * Solder Paste Application * Reflow Soldering * Wave Soldering * Other Manufacturing Techniques and Common Defect Consideration * Reliability and Compatibility, By 2006, any company selling electronics to European Union nations and China will have to convert to a lead-free manufacturing process. This resource shows manufacturers how to select the right Lead Free process and make the conversion as efficient and inexpensive as possible. Contents: Selecting Component Lead Coating * Selecting PCB Surface Finish * Manufacturing Approaches * Solder Paste Application * Reflow Soldering * Wave Soldering * Other Manufacturing Techniques and Common Defect Consideration * Reliability and Compatibility., By June 2006 any company selling electronics into the European Union and China will have to convert to lead-free manufacturing processes Virtually every electronics manufacturer in the world is faced with an expensive revamp of their operations. This book shows them how to choose the right Lead-Free processes and make the conversion as efficiently and inexpensively as possible.
LC Classification Number
TK7836.H93 2004
Copyright Date
2005
ebay_catalog_id
4
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eBay item number:305508488405
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Product is 95% alike picture but a little more blurry. Controller play well but had a notice from psn that my joypad wasn't authentic and could by problematic🤷♂️ no trouble so far! Shipping was fast but no tracking and worst packaging ever.. like the box came banged up... send a question to seller never had a reply 😅.... Good product overall, excellent price, fast shipping, wrapped only on 4 sides out of 6, no tracking and never reply... 4★ product / 2★ seller ✌️
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The book is in perfect condition, brand new, and is exactly as described. This item is difficult to find here, and the seller priced it very reasonably. It shipped from the UK to Canada, and unfortunately took a little longer to arrive than the seller hoped, but it was shipped less than 24 hours after I purchased. When I contacted the seller, they were very responsive and helpful. I would not hesitate to purchase from this seller again. Definitely recommend!
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