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3x BGA chip reballing stencil for MTK Samsung HTC Huawei Android Kits-

Original Text
3x BGA Chip Reballing Schablone Stencil Für MTK Samsung HTC Huawei Android Kits
Condition:
New
More than 10 available / 22 sold
Price:
EUR 5.54
ApproximatelyC $8.20
This one's trending. 22 have already sold.
Shipping:
Does not ship to United States. See detailsfor shipping
Located in: Shenzhen, China
Delivery:
Varies
Returns:
1 month return. Buyer pays for return shipping. See details- for more information about returns
Payments:
     

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Seller information

Registered as a Business Seller
Seller assumes all responsibility for this listing.
eBay item number:332929262444
Last updated on Feb 24, 2024 03:13:24 ESTView all revisionsView all revisions

Item specifics

Condition
New: A brand-new, unused, unopened, undamaged item in its original packaging (where packaging is ...
Quantity
3 pieces
Marke
Markenlos
Herstellernummer
nicht zutreffend
Produktart
Stencil
Modellkompatibilität
Nein
Markenkompatibilität
Nein
EAN
Nicht zutreffend

Item description from the seller

sevenshop888

sevenshop888

98.7% positive feedback
730K items sold

Detailed seller ratings

Average for the last 12 months

Accurate description
4.9
Reasonable shipping cost
5.0
Shipping speed
4.8
Communication
5.0

Seller feedback (192,941)

y***a (127)- Feedback left by buyer.
Past 6 months
Verified purchase
Sehr gut
r***r (629)- Feedback left by buyer.
More than a year ago
Verified purchase
Sehr nette Verkäufer
r***a (260)- Feedback left by buyer.
More than a year ago
Verified purchase
Perfect!!! Coll communication. Fast answering. Perfect service. Reccomend!!!!
See all feedback