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Chip On Board: Technology for Multichip Modules by John H. Lau (English) Hardcov
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- Buy It NowChip On Board: Technology for Multichip Modules by John H. Lau (English) Hardcov
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Located in: Fairfield, Ohio, United States
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Estimated between Fri, Jun 21 and Tue, Jul 2 to 43230
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eBay item number:364695762287
Item specifics
- Condition
- ISBN-13
- 9780442014414
- Book Title
- Chip On Board
- ISBN
- 9780442014414
- Subject Area
- Computers, Technology & Engineering
- Publication Name
- Chip on Board : Technology for Multichip Modules
- Item Length
- 9.3 in
- Publisher
- Springer
- Subject
- Systems Architecture / General, Hardware / General, Electronics / Circuits / Integrated, Manufacturing
- Publication Year
- 1994
- Type
- Textbook
- Format
- Hardcover
- Language
- English
- Item Width
- 6.1 in
- Item Weight
- 76.5 Oz
- Number of Pages
- Xx, 556 Pages
About this product
Product Information
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Product Identifiers
Publisher
Springer
ISBN-10
0442014414
ISBN-13
9780442014414
eBay Product ID (ePID)
854472
Product Key Features
Publication Name
Chip on Board : Technology for Multichip Modules
Format
Hardcover
Language
English
Subject
Systems Architecture / General, Hardware / General, Electronics / Circuits / Integrated, Manufacturing
Publication Year
1994
Type
Textbook
Subject Area
Computers, Technology & Engineering
Number of Pages
Xx, 556 Pages
Dimensions
Item Length
9.3 in
Item Width
6.1 in
Item Weight
76.5 Oz
Additional Product Features
LCCN
93-040440
Number of Volumes
1 Vol.
Lc Classification Number
Qa76.635
Table of Content
Preface; Acknowledgments; A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications; Making COB testing tractable: chip pretest and system diagnostics; Chip level interconnect; wire bonding for multichip modules; Chip level interconnect: wafer bumping and inner lead bonding; Chip level interconnect: solder bumped flip chip; Chip attachment; Wire bonding chip on board; Tape automated bonding chip on board and on MCM-D; Solder bumped flip chip attach on SLC board and multichip module; Micron bump bonding chip on board; chip on board encapsulation; Underfill encapsulation for flip chip applications; Index
Copyright Date
1994
Target Audience
Scholarly & Professional
Dewey Decimal
621.381/046
Dewey Edition
20
Illustrated
Yes
Item description from the seller
Seller assumes all responsibility for this listing.
eBay item number:364695762287
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h***7 (51)- Feedback left by buyer.
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Ok so I ordered this item listed as having free shipping. It was listed at $43.54 with free shipping. Somehow I ended up being charged $65.52. Then after waiting 3 weeks and having absolutely no tracking information I spoke with the seller who agreed to send a replacment, but despite charging me extra money was unwilling to ship that replacment in a way that wouldn't take atleast 3 more weeks. Ultimately this was a complete waste of time and the seller is not one that I would recommend.
0***4 (161)- Feedback left by buyer.
Past month
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This is not a coloring book!!!!! It’s just a book of black and white photos and even if colored over would look horrible! This book is a scam and I have received 2 items out of 3 I ordered and the third hasn’t even been shipped. Tried to message seller but only option given is to send the item number but no way to give reason for dissatisfaction with item! I would advise not ordering anything from this seller…
s***i (300)- Feedback left by buyer.
Past month
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Very well packed and fast shipping will do business again for sure.
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